Substrate transport apparatus and method, exposure apparatus and exposure method, and device fabricating method

ABSTRACT

A substrate transport apparatus, which transports a substrate that has been exposed with an image of a pattern through a projection optical system and a liquid, comprises a substrate support member that supports the substrate, and a liquid removal mechanism that removes the liquid that has adhered to at least one of the substrate support member and at least a portion of the area of the rear surface of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Continuation Application of International Application No.PCT/JP2004/014945, filed Oct. 8, 2004, which claims priority to JapanesePatent Application Nos. 2003-349549 and 2003-349552, both filed on Oct.8, 2003. The contents of the aforementioned applications areincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a substrate transport apparatus andmethod, which transports a substrate that has been exposed by a liquidimmersion method, an exposure apparatus and method, and a devicefabricating method.

2. Description of Related Art

Semiconductor devices and liquid crystal display devices are fabricatedby a so-called photolithography technique, wherein a pattern formed on amask is transferred onto a photosensitive substrate. An exposureapparatus used in this photolithographic process includes a mask stagethat supports the mask, and a substrate stage that supports thesubstrate, and transfers the pattern of the mask onto the substrate viaa projection optical system while successively moving the mask stage andthe substrate stage. There has been demand in recent years for higherresolution projection optical systems in order to handle the much higherlevels of integration of device patterns. The shorter the exposurewavelength used and the larger the numerical aperture of the projectionoptical system, the higher the resolution of the projection opticalsystem. Consequently, the exposure wavelength used in exposureapparatuses has shortened year by year, and the numerical aperture ofprojection optical systems has increased. Furthermore, the mainstreamexposure wavelength currently is the 248 nm KrF excimer laser, but aneven shorter wavelength 193 nm ArF excimer laser is also beingcommercialized. In addition, as with resolution, the depth of focus(DOF) is important when performing an exposure. The following equationsexpress the resolution R and the depth of focus δ, respectively.R=k ₁ ·λ/NA   (1)δ=±k ₂ ·δ/NA ²   (2)

Therein, λ is the exposure wavelength, NA is the numerical aperture ofthe projection optical system, and k₁ and k₂ are the processcoefficients. Equations (1) and (2) teach that if the exposurewavelength λ is shortened and the numerical aperture NA is increased inorder to enhance the resolution R, then the depth of focus δ narrows.

If the depth of focus δ becomes excessively narrow, then it will becomedifficult to align the surface of the substrate with the image plane ofthe projection optical system, and there will be a risk of insufficientmargin of focus during the exposure operation. Accordingly, a liquidimmersion method has been proposed, as disclosed in, for example, PCTInternational Publication WO99/49504 below, as a method to substantiallyshorten the exposure wavelength and increase the depth of focus. Thisliquid immersion method fills a liquid, such as water or an organicsolvent, between the lower surface of the projection optical system andthe surface of the substrate, thus taking advantage of the fact that thewavelength of the exposure light in a liquid is 1/n that of in air(where n is the refractive index of the liquid, normally about 1.2-1.6),thereby improving the resolution as well as increasing the depth offocus by approximately n times.

Incidentally, a substrate transport member unloads the substrate, whichwas exposed by the liquid immersion method, from the substrate stage. Atthis time, if liquid has adhered to the rear surface of the substrate,then the liquid between the substrate transport member and the substrateforms a lubricating film, and the substrate becomes slippery (easilymispositioned) with respect to the substrate transport member, and thereis a possibility of a problem arising wherein the substrate transportmember will no longer be able to transport the substrate in the desiredstate. In addition, if liquid has adhered to the substrate transportmember, then that liquid forms a film that causes the substrate to slipwith respect to the substrate transport member, and there isconsequently a risk that the substrate cannot be transportedsatisfactorily. If liquid has adhered to the substrate in the case wherethe substrate transport member holds the substrate by vacuum suction,then there is a possibility that a problem will arise wherein thatliquid will infiltrate and damage the vacuum system.

In addition, if the transportation is executed in a state wherein liquidhas adhered to the substrate and/or the substrate transport member, thenproblems arise, such as rusting of the various equipments and/or membersin the vicinity of the transport pathway due to the liquid that fallsfrom the substrate during transport, the inability to maintain thecleanliness level of the environment wherein the exposure apparatus isdisposed, and the like. Alternatively, there is also the case whereinthe fallen liquid can bring on environmental changes (humidity changes)in the vicinity of the exposure apparatus.

If liquid has adhered to the substrate transport member, then there is apossibility that that liquid will adhere to and contaminate thesubstrate, and, if the liquid that has adhered to the substrate driesbefore the exposure process, then a trace thereof will remain on thesubstrate surface, which can cause a deterioration of the quality of thedevice that is manufactured. In addition, there is a risk that, in astate wherein liquid has adhered to the substrate after the exposureprocess, for example, if the development process is executed, then itwill cause uneven development and the like, and will also causesubstrate contamination due to the liquid that has adhered to thesubstrate and that will collect impurities (dust and the like) presentin the atmosphere, thus making it impossible to fabricate a device thathas the desired performance.

The present invention is made considering these circumstances, and it isan object of the present invention to provide: a substrate transportapparatus and method, wherein a substrate exposed by the liquidimmersion method can be satisfactorily transported in the desired state;an exposure apparatus and method; and a device fabricating method.

DISCLOSURE OF THE INVENTION

To solve the abovementioned problems, the invention according to a firstaspect of the invention is a substrate transport apparatus thattransports a substrate that has been exposed with an image of a patternthrough a projection optical system and a liquid, comprising: asubstrate support member that supports the substrate; and a liquidremoval mechanism that removes the liquid that has adhered to at leastone of the substrate support member and at least a portion of the areaof the rear surface of the substrate.

In addition, the invention according to a second aspect of the inventionis a substrate transport apparatus that transports a substrate that hasbeen exposed with an image of a pattern through a projection opticalsystem and a liquid, comprising: a substrate transport member thattransports the substrate and that has a moisture absorbing material thatabsorbs the liquid.

In addition, the invention according to a third aspect of the inventionis a substrate transport apparatus that transports a substrate that hasbeen exposed with an image of a pattern through a projection opticalsystem and a liquid, comprising: a first liquid removal mechanism thatremoves liquid that has adhered to a portion of the area of the rearsurface of the substrate; and a second liquid removal mechanism that,after the liquid that has adhered to the portion of the area of the rearsurface of the substrate has been removed by the first liquid removalmechanism, removes the liquid that has adhered to the front surface ofthe substrate.

In addition, the invention according to a fourth aspect of the inventionis a substrate transporting method that transports a substrate that hasbeen exposed with an image of a pattern through a projection opticalsystem and a liquid, comprising: removing, before supporting the rearsurface of the substrate by a substrate support member, liquid that hasadhered to a support area, which is supported by the substrate supportmember, of the rear surface of the substrate.

In addition, the invention according to a fifth aspect of the inventionis a substrate transporting method that transports a substrate that hasbeen exposed with an image of a pattern through a projection opticalsystem and a liquid, comprising: removing liquid that has adhered to aportion of the area of the rear surface of the substrate; and removing,after the liquid that has adhered to the portion of the area has beenremoved, liquid that has adhered to the front surface of the substrate.

According to the present invention discussed above, the substrate can betransported in the desired state when transporting such after theimmersion exposure process, and therefore a device having the desiredperformance can be manufactured.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic block diagram that shows one embodiment of adevice fabrication system as an exposure apparatus of the presentinvention.

FIG. 2 is a drawing of FIG. 1 viewed from above.

FIG. 3 is a schematic block diagram that shows one embodiment of anexposure apparatus main body that performs the exposure process.

FIG. 4 is a view that shows an example of the arrangement of the supplynozzles and the recovery nozzles.

FIG. 5 is a schematic block diagram that shows one embodiment of atransport arm member according to the present invention.

FIG. 6A is a drawing that shows one embodiment of a liquid removaloperation performed by a transport arm member according to the presentinvention.

FIG. 6B is a drawing that shows one embodiment of a liquid removaloperation performed by a transport arm member according to the presentinvention.

FIG. 7A is a schematic block diagram that shows one embodiment of aholding table according to the present invention.

FIG. 7B is a schematic block diagram that shows one embodiment of theholding table according to the present invention.

FIG. 8A is a drawing that shows one embodiment of the liquid removaloperation performed by the holding table according to the presentinvention.

FIG. 8B is a drawing that shows one embodiment of the liquid removaloperation performed by the holding table according to the presentinvention.

FIG. 9 is a drawing that shows one embodiment of the liquid removaloperation performed by a first liquid removal system.

FIG. 10 is a schematic block diagram that shows another embodiment of atransport arm member according to the present invention.

FIG. 11 is a schematic block diagram that shows another embodiment of atransport arm member according to the present invention.

FIG. 12A depicts another embodiment of the liquid removal operationperformed by the first liquid removal system.

FIG. 12B is a drawing that shows another embodiment of the liquidremoval operation performed by the first liquid removal system.

FIG. 13 is a drawing that shows another embodiment of the liquid removaloperation performed by the first liquid removal system.

FIG. 14 is a drawing that shows another embodiment of the liquid removaloperation performed by the first liquid removal system.

FIG. 15 is a schematic drawing of an exemplary constitution of a secondliquid removal system.

FIG. 16 is a schematic drawing of another exemplary constitution of thesecond liquid removal system.

FIG. 17 is a schematic drawing of another exemplary constitution of thesecond liquid removal system.

FIG. 18 is a schematic drawing of another embodiment of a transportsystem provided with the second liquid removal system.

FIG. 19 is a flow chart that shows one example of the process offabricating a semiconductor device.

DETAILED DESCRIPTION OF THE INVENTION

The following explains the embodiments of the present invention,referencing the drawings. FIG. 1 shows one embodiment of a devicefabrication system provided with an exposure apparatus of the presentinvention, and is a schematic block diagram viewed from the side; FIG. 2is a drawing of FIG. 1 viewed from above.

In FIG. 1 and FIG. 2, a device fabrication system SYS includes anexposure apparatus EX-SYS and a coater and developer apparatus C/D-SYS(refer to FIG. 2). The exposure apparatus EX-SYS includes: an interfacepart IF (refer to FIG. 2) that forms a connection part to the coater anddeveloper apparatus C/D-SYS; an exposure apparatus main body EX thatfills a liquid LQ in a space between a projection optical system PL anda substrate P, and exposes the substrate P by projecting, through theprojection optical system PL and the liquid LQ, a pattern formed on amask onto the substrate P; a transport system H that transports thesubstrate P between the interface part IF and the exposure apparatusmain body EX; a first liquid removal system 100 that is provided on thetransport pathway of the transport system H and that removes the liquidLQ adhering to the surface of the substrate P; a second liquid removalsystem 220 that is provided on the transport pathway and that removesthe liquid LQ adhering to the surface of the second arm member H2; and acontrol apparatus CONT that performs overall control of the operation ofthe entire exposure apparatus EX-SYS. The coater and developer apparatusC/D-SYS includes: a coater apparatus C that coats the base material ofthe substrate P, before it has been exposed, with a photoresist(photosensitive agent); and a developer apparatus (processing apparatus)D that performs the development process of the substrate P, after it hasbeen exposed, in the exposure apparatus main body EX. As shown in FIG.2, the exposure apparatus main body EX is disposed inside a firstchamber apparatus CH1, wherein the cleanliness level is controlled.Meanwhile, the coater apparatus C and the developer apparatus D aredisposed inside a second chamber apparatus CH2, which is separate fromthe first chamber apparatus CH1. Furthermore, the first chamberapparatus CH1, wherein the exposure apparatus main body EX is housed,and the second chamber apparatus CH2, wherein the coater apparatus C andthe developer apparatus D are housed, are connected via the interfacepart IF. Here, the coater apparatus C and the developer apparatus D,which are housed inside the second chamber apparatus CH2, arecollectively called a “coater and developer main body C/D,” in thepresent invention.

As shown in FIG. 1, the exposure apparatus main body EX includes anillumination optical system IL that illuminates a mask M, which issupported by a mask stage MST, with exposure light EL; the projectionoptical system PL that projects onto the substrate P the pattern imageof the mask M, which is illuminated by the exposure light EL; and asubstrate stage PST that supports the substrate P. In addition, theexposure apparatus EX in the present embodiment is a scanning typeexposure apparatus (a so-called scanning stepper) that exposes thesubstrate P with the pattern formed on the mask M while synchronouslymoving the mask M and the substrate P in the scanning directions and inmutually different directions (opposite directions). In the followingexplanation, the direction in which the mask M and the substrate Psynchronously move (scanning directions) within the horizontal plane isthe X axial direction, the direction orthogonal to the X axial directionwithin the horizontal plane is the Y axial direction (non-scanningdirection), and the direction perpendicular to the X axial and the Yaxial directions, and that coincide with an optical axis AX of theprojection optical system PL, is the Z axial direction. In addition, therotational (inclined) directions around the X, Y, and Z axes are the θX,θY, and θZ directions, respectively. Furthermore, “substrate” hereinincludes one on which a semiconductor wafer is coated with aphotoresist, and “mask” includes a reticle wherein a device pattern,which is reduction-projected onto the substrate, is formed.

The transport system H includes a first arm member H1 that loads asubstrate P, which has not yet been exposed, onto the substrate stagePST, and a second arm member H2 that unloads the substrate P, after ithas been exposed, from the substrate stage PST. As shown in FIG. 2, thesubstrate P, which has not yet been exposed, that was transported fromthe coater apparatus C is conveyed via the interface part IF to a thirdarm member H3. The third arm member H3 hands the substrate P over to aprealignment unit PAL. The prealignment unit PAL roughly aligns thesubstrate P with respect to the substrate stage PST. The first armmember H1 loads the substrate P, which was aligned by the prealignmentunit PAL, onto the substrate stage PST. The second arm member H2 unloadsthe substrate P, for which the exposure process has completed, from thesubstrate stage PST. The second arm member H2 hands the substrate P,after it has been exposed, over to a holding table HT, which is providedon the transport pathway of that substrate P. The holding table HTconstitutes a part of the first liquid removal system 100, andtemporarily holds the substrate P. The holding table HT is disposedinside a cover member 70, which is provided with opening parts 71 and 72for passing the transported substrate P therethrough. The opening parts71 and 72 are provided with shutter parts 71A and 72A, respectively,which open and close the opening parts 71 and 72. The holding table HTrotatably holds the substrate P; additionally, the substrate P, forwhich the orientation was changed by the rotation of that holding tableHT, is held by a fourth arm member H4 and transferred to the interfacepart IF. The substrate P that was transported to the interface part IFis conveyed to the developer apparatus D. The developer apparatus Dperforms the development process to the substrate P.

Furthermore, the first through fourth arm members (transport armmembers) H1-H4, the prealignment unit PAL, and the holding table HT arealso disposed inside the first chamber apparatus CH1. Here, the firstand second chamber apparatuses CH1 and CH2 are each provided with anopening part and a shutter, which opens and closes the opening part, atthe portion facing the interface part IF. The shutters are open duringthe operation of transporting the substrate P to the interface part IF.

The first arm member H1 holds the substrate P that has not yet beenexposed and to which the liquid LQ is not adhered, and loads thesubstrate P onto the substrate stage PST. Meanwhile, the second armmember H2 holds the substrate P, to which there is a possibility thatthe liquid LQ has adhered after the immersion exposure process, andunloads such from the substrate stage PST. Thus, the first arm memberH1, which transports the substrate P to which the liquid LQ is notadhered, and the second arm member H2, which transports the substrate Pto which there is a possibility that the liquid LQ has adhered, are usedseparately, which makes it possible to prevent the adherence of theliquid LQ to the rear surface of the substrate P that is to be loaded onthe substrate stage PST, without the liquid LQ adhering to the first armmember H1. Accordingly, even though a substrate holder of the substratestage PST is constituted so that it holds the substrate P by vacuumsuction, it is possible to prevent the problem of the liquid LQinfiltrating a vacuum system, such as a vacuum pump, through a suctionhole of the substrate holder.

FIG. 3 is a schematic block diagram of the exposure apparatus main bodyEX.

The illumination optical system IL illuminates the mask M, which issupported by the mask stage MST, with the exposure light EL andincludes: an exposure light source; an optical integrator thatuniformizes the intensity of the luminous flux emitted from the exposurelight source; a condenser lens that condenses the exposure light EL fromthe optical integrator; a relay lens system; and a variable field stopthat sets an illumination region on the mask M illuminated by theexposure light EL to be slit shaped; and the like. The illuminationoptical system IL illuminates the prescribed illumination region on themask M with the exposure light EL, which has a uniform luminous fluxintensity distribution. Examples of light that can be used as theexposure light EL emitted from the illumination optical system ILinclude: deep ultraviolet light (DUV light), such the bright lines (g-,h-, and i-lines) and KrF excimer laser light (248 nm wavelength) in theultraviolet region emitted from, for example, a mercury lamp; and vacuumultraviolet light (VUV light), such as ArF excimer laser light (193 nmwavelength) and F₂ laser light (157 nm wavelength). The presentembodiment will be explained by citing an example of a case of using ArFexcimer laser light.

The mask stage MST supports the mask M and is two dimensionally movablein the plane perpendicular to the optical axis AX of the projectionoptical system PL, i.e., in the XY plane, and is finely rotatable in theθZ direction. A mask stage drive apparatus MSTD, such as a linear motor,drives the mask stage MST. The control apparatus CONT controls the maskstage drive apparatus MSTD. A movable mirror 56 is provided on the maskstage MST, and a laser interferometer 57 is provided at a positionopposing the movable mirror 56. The laser interferometer measures inreal time the position in the two dimensional directions and therotational angle of the mask stage MST, which holds the mask M, andoutputs these measurement results to the control apparatus CONT. Thecontrol apparatus CONT drives the mask stage drive apparatus MSTD basedon the measurement results of the laser interferometer, and therebypositions the mask M, which is supported by the mask stage MST.

The projection optical system PL projection-exposes the pattern of themask M onto the substrate P at a prescribed projection magnification β,and is constituted by a plurality of optical elements (lenses, mirrors,and the like), which are housed in a lens barrel PK. In the presentembodiment, the projection optical system PL is a reduction system thathas a projection magnification β of, for example, ¼ or ⅕. Furthermore,the projection optical system PL may be a unity magnification system oran enlargement system. In addition, an optical element (lens) 2 isexposed to the exterior of the lens barrel PK on the tip side (substrateP side) of the projection optical system PL according to the presentembodiment. This optical element 2 is provided so that it is detachable(i.e., replaceable) from the lens barrel PK.

The optical element 2 is made of fluorite. Because fluorite has a highaffinity to pure water, the liquid LQ can contact with substantially theentire surface of a tip surface (liquid contact surface) 2 a of theoptical element 2. Namely, because the liquid (water) LQ supplied in thepresent embodiment has a high affinity to the liquid contact surface 2 aof the optical element 2, the contact degree between the liquid contactsurface 2 a of the optical element 2 and the liquid LQ is high.Furthermore, the optical element 2 may be made of quartz, which also hasa high affinity to water. In addition, the liquid contact surface 2 a ofthe optical element 2 may be given hydrophilic (lyophilic) treatment inorder to further raise its affinity to the liquid LQ.

The substrate stage PST supports the substrate P and includes a Z stage51 that holds the substrate P via a substrate holder, an XY stage 52that supports the Z stage 51, and a base 53 that supports the XY stage52. A substrate stage drive apparatus PSTD, such as a linear motor,drives the substrate stage PST. The control apparatus CONT controls thesubstrate stage drive apparatus PSTD. By driving the Z stage 51, theposition of the substrate P held on the Z stage 51 in the Z axialdirections (the focus position) and in the θX and θY directions iscontrolled. In addition, by driving the XY stage 52, the position of thesubstrate P in the XY direction (the position in a directionsubstantially parallel to the image plane of the projection opticalsystem PL) is controlled. In other words, the Z stage 51 controls thefocus position and the inclination angle of the substrate P, and alignsthe surface of the substrate P with the image plane of the projectionoptical system PL by an auto focus system and an auto leveling system.Further, the XY stage 52 positions the substrate P in the X axialdirections and Y axial directions. Furthermore, the Z stage and the XYstage may of course be integrally provided.

A movable mirror 54 is provided on the substrate stage PST (the Z stage51). In addition, a laser interferometer 55 is provided at a positionopposing the movable mirror 54. The laser interferometer 55 measures inreal time the position in the two dimensional direction as well as therotational angle of the substrate P on the substrate stage PST, andoutputs these measurement results to the control apparatus CONT. Thecontrol apparatus CONT drives the substrate stage drive apparatus PSTDbased on the measurement results of the laser interferometer 55, andthereby positions the substrate P supported on the substrate stage PST.

A liquid immersion method is adopted in the present embodiment in orderto substantially shorten the exposure wavelength and improve resolution,while also substantially increasing the depth of focus. Consequently, atleast while the pattern image of the mask M is being transferred ontothe substrate P, the prescribed liquid LQ is filled in the space betweenthe surface of the substrate P and the tip surface 2 a of the opticalelement 2 of the projection optical system PL. As discussed above, thepresent embodiment is constituted so that the optical element 2 isexposed to the exterior on the tip side of the projection optical systemPL, and so that the liquid LQ contacts only the optical element 2.Corrosion and the like of the lens barrel PK, which is made of metal, isthereby prevented. Pure water is used as the liquid LQ in the presentembodiment. Pure water can transmit this exposure light EL not only ifit is ArF excimer laser light, but also if it is deep ultraviolet light(DUV light), such as the bright lines (g-, h-, and i-lines) and KrFexcimer laser light (248 nm wavelength) in the ultraviolet regionemitted from, for example, a mercury lamp.

The exposure apparatus main body EX is provided with a liquid supplymechanism 10 that supplies the liquid LQ between the substrate P and thetip surface 2 a of the optical element 2 of the projection opticalsystem PL, and a liquid recovery mechanism 20 that recovers the liquidLQ on the substrate P. The liquid supply mechanism 10 supplies theprescribed liquid LQ to the substrate P in order to form an immersionarea AR2 thereon, and includes: a liquid supply apparatus 11, which iscapable of feeding the liquid LQ; and supply nozzles 13, which areconnected to the liquid supply apparatus 11 via a supply pipe 12, thateach have a supply port through which the liquid LQ, which is fed fromthis liquid supply apparatus 11, is supplied to the substrate P. Thesupply nozzles 13 are disposed close to the surface of the substrate P.

The liquid supply apparatus 11 includes a tank that stores the liquidLQ, a pressurizing pump, and the like, and supplies the liquid LQ to thesubstrate P through the supply pipe 12 and the supply nozzles 13. Inaddition, the control apparatus CONT controls the operation wherein theliquid is supplied by the liquid supply apparatus 11, and can controlthe amount of liquid supplied per unit of time by the liquid supplyapparatus 11 to the substrate P. In addition, the liquid supplyapparatus 11 includes a mechanism for adjusting the temperature of theliquid LQ, and supplies the substrate P with the liquid LQ, which has atemperature (for example, 23° C.) substantially the same as that insidethe chamber that houses the apparatus.

The liquid recovery mechanism 20 recovers the liquid LQ on the substrateP, and includes recovery nozzles 23, which are disposed close to, butnot in contact with, the surface of the substrate P, and a liquidrecovery apparatus 21, which is connected to the recovery nozzles 23 viaa recovery pipe 22. The liquid recovery apparatus 21 includes a vacuumsystem (suction apparatus), e.g., a vacuum pump, a tank that stores therecovered liquid LQ, and the like, and recovers the liquid LQ on thesubstrate P through the recovery nozzles 23 and the recovery pipe 22.The control apparatus CONT controls the operation of recovering theliquid by the liquid recovery apparatus 21, and can control the amountof liquid recovered per unit of time thereby.

During scanning exposure, the pattern image of one part of the mask M isprojected onto a projection area AR1 that is directly below the opticalelement 2 at the tip of the projection optical system PL, and thesubstrate P moves at a velocity β·V (where β is the projectionmagnification) in the +X direction (or the −X direction) via the XYstage 52 in synchronization with the movement of the mask M at avelocity V in the −X direction (or the +X direction) with respect to theprojection optical system PL. Further, after the exposure of one shotregion is complete, the next shot region moves to the scanning startposition by stepping the substrate P, and the exposure process issubsequently performed sequentially for each shot region by thestep-and-scan system. The present embodiment is set so that the liquidLQ flows along the movement direction of the substrate P.

FIG. 4 shows the positional relationships between the projection areaAR1 of the projection optical system PL, the supply nozzles 13 (13A-13C)that supply the liquid LQ in the X axial directions, and the recoverynozzles 23 (23A and 23B) that recover the liquid LQ. In FIG. 4, theshape of the projection area AR1 of the projection optical system PL isa rectangle that is long and thin in the Y axial directions; further,three supply nozzles 13A-13C are disposed on the +X direction side, andtwo recovery nozzles 23A and 23B are disposed on the −X direction sideso that the projection area AR1 is interposed therebetween in the Xaxial directions. Furthermore, the supply nozzles 13A-13C are connectedto the liquid supply apparatus 11 by the supply pipe 12, and therecovery nozzles 23A and 23B are connected to the liquid recoveryapparatus 21 by the recovery pipe 22. In addition, supply nozzles15A-15C and recovery nozzles 25A and 25B are disposed in a positionalrelationship so that they are rotated substantially 180° with respect tothe supply nozzles 13A-13C and the recovery nozzles 23A and 23B. Thesupply nozzles 13A-13C and the recovery nozzles 25A and 25B are arrayedalternately in the Y axial directions, the supply nozzles 15A-15C andthe recovery nozzles 23A and 23B are arrayed alternately in the Y axialdirections, the supply nozzles 15A-15C are connected to the liquidsupply apparatus 11 by a supply pipe 14, and the recovery nozzles 25Aand 25B are connected to the liquid recovery apparatus 21 by a recoverypipe 24.

Furthermore, if scanning exposure is being performed by moving thesubstrate P in a scanning direction (−X direction) shown by, forexample, the arrow Xa, then the liquid LQ is supplied and recovered bythe liquid supply apparatus 11 and the liquid recovery apparatus 21using the supply pipe 12, the supply nozzles 13A-13C, the recovery pipe22, and the recovery nozzles 23A and 23B. Namely, when the substrate Pmoves in the −X direction, the liquid LQ is supplied from the liquidsupply apparatus 11 through the supply pipe 12 and the supply nozzles 13(13A-13C) onto the substrate P, is recovered by the liquid recoveryapparatus 21 through the recovery nozzles 23 (23A and 23B) and therecovery pipe 22, and thereby flows in the −X direction so that it fillsthe space between the projection optical system PL and the substrate P.Meanwhile, if scanning exposure is performed by moving the substrate Pin a scanning direction (+X direction) shown by the arrow Xb, then theliquid LQ is supplied and recovered by the liquid supply apparatus 11and the liquid recovery apparatus 21 using the supply pipe 14, thesupply nozzles 15A-15C, the recovery pipe 24, and the recovery nozzles25A and 25B. Namely, when the substrate P moves in the +X direction, theliquid LQ is supplied from the liquid supply apparatus 11 through thesupply pipe 14 and the supply nozzles 15 (15A-15C) onto the substrate P,is recovered by the liquid recovery apparatus 21 through the recoverynozzles 25 (25A and 25B) and the recovery pipe 24, and thereby flows inthe +X direction so that it fills the space between the projectionoptical system PL and the substrate P. Thus, the control apparatus CONTuses the liquid supply apparatus 11 and the liquid recovery apparatus 21to flow the liquid LQ along the movement direction of the substrate P ina direction identical thereto. In this case, the liquid LQ, which issupplied, for example, from the liquid supply apparatus 11 through thesupply nozzles 13, flows along with the movement of the substrate P inthe −X direction so that it is pulled into the space between theprojection optical system PL and the substrate P, and it is thereforepossible to easily supply the liquid LQ thereto even if the supplyenergy of the liquid supply apparatus 11 is small. Furthermore, byswitching the direction of flow of the liquid LQ in accordance with thescanning direction, it is possible to fill the liquid LQ between theprojection optical system PL and the substrate P, and to obtain a highresolution and great depth of focus regardless of whether the substrateP is scanned in the +X direction or the −X direction.

FIG. 5 is a schematic oblique view that shows the second arm member H2,which unloads the substrate P after the completion of the exposureprocess, on which the liquid LQ has adhered, from the substrate stagePST. In FIG. 5, the second arm member H2 is constituted by a forked handthat supports the rear surface of the substrate P and transports thatsubstrate P. The second arm member H2 has an upper surface (supportsurface) 30, which opposes the rear surface of the substrate P, andsupports the substrate P thereby. A plurality of suction holes 31, whichare opening parts for holding the rear surface of the substrate P bysuction, are provided in the support surface 30 of the second arm memberH2 so that they are evenly spaced at prescribed intervals oversubstantially the entire area of the support surface 30. A vacuum system(suction mechanism) 34 is connected to the suction holes 31 by apassageway 31A, which is formed inside the second arm member H2. Thevacuum system 34 is constituted by a vacuum pump provided to theexposure apparatus main body EX, or a vacuum system in the factory inwhich the device fabrication system SYS is installed. A suctionmechanism 37, which is configured to include the vacuum system 34 andthe suction holes 31, activates the vacuum system 34 in order to supportthe rear surface of the substrate P, and applies suction to the rearsurface of the substrate P through the suction holes 31.

In addition, blow holes 32, which are opening parts at positionsdifferent from the suction holes 31, are provided in the support surface30 of the second arm member H2. In the present embodiment, the blowholes 32 are provided and disposed between the suction holes 31, and areprovided substantially evenly over the entire area of the supportsurface 30 of the second arm member H2. A gas supply system 35 isconnected to the blow holes 32 via a passageway 32A, which is formedinside the second arm member H2. A gas blowing mechanism (liquid removalmechanism) 36 is configured to include the gas supply system 35 and theblow holes 32. The passageway 32A is provided with a filter that removesforeign matter (waste and oil mist) in the air that is blown against thesubstrate P. By activating the gas supply system 35, the prescribed gasis blown out from the blow holes through the passageway 32A. Inaddition, the control apparatus CONT controls the operation of the gassupply system 35, and is capable of adjusting the volume of gas blownout from the blow holes 32 per unit of time by controlling the gassupply system 35.

In addition, protruding portions 33, which are positioning members, areprovided at a plurality of prescribed positions on the support surface30 of the second arm member H2. The protruding portions 33 prevent theoccurrence of problems, such as the substrate P becoming mispositioned,falling off the second arm member H2, and the like, when supporting therear surface of the substrate P by the support surface 30 of the secondarm member H2.

The following explains the operation of the exposure apparatus main bodyEX and the transport system H discussed above.

In the exposure apparatus main body EX, the exposure process isperformed for the substrate P, which is held by the substrate stage PST,using the liquid immersion method. After the completion of the immersionexposure process for each of the plurality of shot regions on thesubstrate P, the control apparatus CONT stops the supply of the liquidonto the substrate P by the liquid supply mechanism 10. Meanwhile, evenafter the liquid supply operation by the liquid supply mechanism 10 hasbeen stopped, the control apparatus CONT continues to activate theliquid recovery mechanism 20 for just a prescribed time period. Thereby,the liquid LQ on the substrate P is sufficiently recovered. Furthermore,after the elapse of the abovementioned predetermined time period, thecontrol apparatus CONT stops the operation of the liquid recoverymechanism 20 and, as shown in the schematic drawing of FIG. 6A, retractsthe substrate stage PST from below the projection optical system PL inthe horizontal direction. Here, liftable pin members 570 are providedinside the Z stage 51 (substrate holder) of the substrate stage PST. Byraising and lowering the pin members 570, they rise and fall withrespect to the upper surface of the Z stage 51. After the substratestage PST is retracted from below the projection optical system PL, thecontrol apparatus CONT raises the pin members 570 in order to raise thesubstrate P above the Z stage 51. Furthermore, the control apparatusCONT advances the second arm member H2 to the lower side (rear surfaceside) of the substrate P, which was raised by the pin members 570. Afterthe second arm member H2 has been disposed on the lower side of thesubstrate P and before supporting the rear surface of the substrate P bythe second arm member H2, the control apparatus CONT operates the gassupply system 35 and blows gas through the blow holes 32 against therear surface of the substrate P. Furthermore, the rear surface of thesubstrate P and the support surface 30 of the second arm member H2 arespaced apart by a prescribed distance when blowing the gas against therear surface of the substrate P from the blow holes 32. Even if, forexample, the liquid LQ has adhered to the rear surface of the substrateP, the blowing of the gas thereagainst by the gas blowing mechanism(first liquid removal apparatus) 36, which is configured to include thegas supply system 35 and the blow holes 32, makes it possible to blowoff and remove that liquid LQ from the substrate P.

At this point, when the gas blowing mechanism 36 blows gas against therear surface of the substrate P from the blow holes 32, it is preferableto dispose a cover member 58 so that it surrounds the second arm memberH2 and the substrate P, as shown in FIG. 6A. In so doing, it is possibleto prevent the scattering (adhesion) of the liquid LQ blown off from therear surface of the substrate P to the surrounding equipments. In thepresent embodiment, the cover member 58 is constituted by a plurality ofsegment members, and each segment member is provided with a drivemechanism. Furthermore, the present embodiment is configured so that thesegment members (cover member) each approach the substrate stage PST bymeans of its drive mechanism after the substrate stage PST is retractedfrom below the projection optical system PL.

Here, the gas blowing mechanism 36 positions the second arm member H2 ina state spaced apart from the rear surface of the substrate P by aprescribed distance, and blows gas against a portion of the area of therear surface of the substrate P; alternatively, the gas blowingmechanism 36 can blow gas against an area, which is larger than theabovementioned the portion of the area of the rear surface of thesubstrate P, while the second arm member H2 moves in a state wherein itis spaced apart from the rear surface of the substrate P by a prescribeddistance. Furthermore, gas may be blown against the entirety or aportion of the rear surface of the substrate P while changing the gapbetween the second arm member H2 and the rear surface of the substrateP. In so doing, the liquid LQ that has adhered to the rear surface ofthe substrate P can be removed. Of course, gas may be blown against therear surface of the substrate P at this time while the substrate stagePST, which supports the substrate P via the pin members 570, moveswithout moving the second arm member H2, or the gas may be blown whilethe second arm member H2 and the substrate P (substrate stage PST) moverelative to one another.

Furthermore, the liquid LQ should be removed from at least the portionof the area of the rear surface of the substrate P with which thesupport surface 30 of the second arm member H2 contacts, i.e., thesupport area, which is supported by the second arm member H2.

After the liquid LQ that has adhered to at least the area of the rearsurface of the substrate P supported by the second arm member H2 hasbeen removed, the operation of the gas supply system 35 is stopped.Subsequently, as shown in FIG. 6B, the second arm member H2 approachesthe rear surface of the substrate P, and the rear surface of thesubstrate P and the support surface 30 of the second arm member H2 comeinto contact with each other. Thereafter, the control apparatus CONTactivates the vacuum system 34, which constitutes the suction mechanism37. Thereby, the rear surface of the substrate P is held by suction bythe suction holes 31 provided in the support surface 30 of the secondarm member H2. Because the liquid LQ that has adhered to the rearsurface of the substrate P is removed before supporting the rear surfaceof that substrate P by the second arm member H2, the second arm memberH2 can satisfactorily hold the substrate P without causingmispositioning of it. In addition, because the liquid LQ has not adheredto the rear surface of the substrate P, the liquid LQ does notinfiltrate the vacuum system 34 through the suction holes 31, even whenthe rear surface of the substrate P is held by suction by the suctionmechanism 37. Accordingly, it is possible to prevent the occurrence ofproblems, such as damaging the vacuum system 34.

The second arm member H2, which holds the substrate P, transports thesubstrate P to the holding table HT. Here, there is a possibility thatthe liquid LQ has adhered to the front surface of the substrate P, to anarea outside of the area of the rear surface of the substrate Psupported by the second arm member H2, and the like. Incidentally, asshown in FIG. 1, a recovery mechanism 60, which recovers the liquid thatdropped from the post-exposure substrate P, is disposed along thetransport pathway of the substrate P between the substrate stage PST andthe holding table HT, which makes it possible to prevent the scatteringof the liquid LQ from the substrate P to the equipments and members inthe vicinity of the transport pathway, and to prevent the adhesion ofthe liquid LQ to those equipments and members, even if, for example, thesubstrate P is transported in a state with the liquid LQ adheredthereto. Here, the recovery mechanism 60 includes a drain member 61,which is disposed below the transport pathway of the second arm memberH2, and a liquid suction apparatus 62, which discharges the liquid LQrecovered by the drain member 61 therefrom, as shown in FIG. 1. Thedrain member 61 is provided inside the first chamber apparatus CH1, andthe liquid suction apparatus 62 is provided outside of the first chamberapparatus CH1. The drain member 61 and the liquid suction apparatus 62are connected by a pipeline 63, and the pipeline 63 is provided with avalve 63A that opens and closes the passageway of this pipeline 63.

Although the liquid LQ may drops from the post-exposure substrate Pwhile the second arm member H2 is transporting the substrate P, to whichthe liquid LQ has adhered, that dropped liquid LQ can be recovered bythe drain member 61. The recovery of the dropped liquid LQ by the drainmember 61 makes it possible to prevent problems, such as the scatteringof the liquid LQ to the surroundings of the transport pathway.Furthermore, by sucking the liquid LQ on the drain member 61 providedinside the chamber apparatus CH1, the liquid suction apparatus 62 candischarge the liquid LQ outside of the chamber apparatus CH1 so that theliquid LQ does not pool in the drain member 61 inside the chamberapparatus CH1, which makes it possible to prevent the problem ofhumidity fluctuations (environmental fluctuations), inside the chamberapparatus CH1. Here, the liquid suction apparatus 62 can continuouslyperform the operation of sucking the liquid LQ recovered in the drainmember 61, or can intermittently perform such operation only at presetprescribed intervals. By performing the suction operation continuously,the liquid LQ does not pool in the drain member 61, which makes itpossible to remarkably improve the prevention of humidity fluctuationsinside the chamber apparatus CH1. Meanwhile, without performing thesuction operation (discharge operation) by the liquid suction apparatus62 during the exposure of the substrate P in the exposure apparatus mainbody EX, by performing the suction operation only during, for example,the time period in which the exposure is not performed, it is possibleto prevent the problem wherein vibrations generated by the suctionoperation adversely affect the exposure accuracy.

FIGS. 7A and B show the holding table HT, which temporarily holds thesubstrate P that was transported by the second arm member H2, whereinFIG. 7A is a side view and FIG. 7B is a plan view. In FIG. 7, theholding table HT, which constitutes a substrate support member, issubstantially circularly shaped in a plan view, and a blow hole 42,which is an opening part, is provided at substantially the center partof the upper surface (support surface) 40 thereof. Although the presentembodiment is configured so that one blow hole 42 is provided, it isalso possible to provide a blow hole 42 at each of a plurality ofarbitrary positions in the support surface 40. Furthermore, the supportsurface 40 is provided with a plurality of suction holes 41 atprescribed intervals so that they surround the blow hole 42.Furthermore, the vacuum system 34 is connected to the suction holes 41via a passageway 41A, which is formed inside the holding table HT. Thevacuum system 34 and the suction holes 41 constitute a suction mechanism45. In addition, the gas supply system 35 is connected to the blow hole42 by a passageway 42A, which is formed inside the holding table HT. Thegas supply system 35 and the blow hole 42 constitute a gas blowingmechanism 46. The passageway 42A is provided with a filter, whichremoves foreign matter (waste, oil mist, and the like) in the gas thatis blown against the substrate P.

FIGS. 8A and B show the first liquid removal system 100. The firstliquid removal system 100 principally removes the liquid LQ that hasadhered to at least one of the front surface and the rear surface of thesubstrate P. These drawings show the operation wherein the second armmember H2 transports the substrate P to the holding table HT. In FIG.8A, the second arm member H2, which holds the substrate P, entersthrough the opening part 71 to the interior of the cover member 70,which houses the holding table HT. At this time, the control apparatusCONT drives the shutter part 71A to open the opening part 71. Meanwhile,the opening part 72 is closed by the shutter part 72A. After thesubstrate P, of which a prescribed area is supported by the second armmember H2, is disposed above the holding table HT, the control apparatusCONT activates the gas supply system 35, which constitutes the gasblowing mechanism 46, and blows gas against the rear surface of thesubstrate P from the blow holes 42. Here, as discussed above, the liquidLQ on the portion of the area (first support area) of the rear surfaceof the substrate P that is supported by the second arm member H2, hasalready been removed by the gas that was blown thereagainst from theblow holes 32, which are provided to the second arm member H2, but thereis a possibility that the liquid LQ has adhered to the area of the rearsurface of the substrate P at which the second arm member H2 does notsupport. Therefore, before the holding table HT, which constitutes apart of the first liquid removal system 100, supports the rear surfaceof the substrate P, the control apparatus CONT blows off and removes theliquid LQ that has adhered to the area (second support area), which isto be supported by the holding table HT, of the rear surface of thesubstrate P by blowing gas against the rear surface of the substrate Pfrom the blow hole 42. Namely, the blow hole 42 and the gas supplysystem 35 connected thereto constitute a third liquid removal apparatusthat removes the liquid LQ that has adhered to the area (second supportarea), which is to be held by the holding table HT (second liquidremoval apparatus), of the rear surface of the substrate P.

When removing the liquid LQ that has adhered to the rear surface of thesubstrate P, gas is blown thereagainst from the blow hole 42 in a statewherein the rear surface of the substrate P, which is held by the secondarm member H2, and the support surface 40 of the holding table HT arespaced apart by a predetermined spacing. By blowing the gas, the liquidLQ that has adhered to the rear surface of the substrate P is blown offand removed. The removed liquid LQ does not scatter from the covermember 70 to the surroundings. Furthermore, the present embodiment isconstituted so that the holding table HT, which includes the blow hole42 and the second arm member H2 that holds the substrate P, do not movewhen blowing gas against the rear surface of the substrate P; however,because the gas that is blown out from the blow hole 42 is blown againstthe substantially center part of the rear surface of the substrate P,and then flows toward the edge part of the substrate P, the liquid LQthat has adhered to the rear surface of the substrate P in the vicinityof the edge part can be satisfactorily removed. Of course, it is alsopossible to blow the gas against the rear surface of the substrate Pwhile moving the substrate P relative to the blow hole 42. For example,the gas may be blown against the rear surface of the substrate P whilemoving the second arm member H2, which holds the substrate P, in the Xaxial direction (Y axial direction) and moving the holding table HT,which has the blow hole 42, in the Y axial direction (X axialdirection). Alternatively, the substrate P and the blow hole 42 may bemoved rotationally relative to one another. Furthermore, the gas may beblown against the rear surface of the substrate P in a state wherein thesecond arm member H2 is operated to incline that substrate P. In sodoing, the liquid LQ that has adhered to the rear surface of thesubstrate P collects in one place due to its own weight (effect ofgravity), making it easy to drop (be removed) from the substrate P.Furthermore, if the liquid LQ has adhered to the second arm member H2,then that liquid LQ can be removed together with the liquid LQ that hasadhered to the substrate P.

A liquid recovery part 80 is connected to the cover member 70 by arecovery pipe 81. The recovery pipe 81 is provided with a valve 82,which opens and closes the passageway of that recovery pipe 81. Theliquid LQ that is blown off from the substrate P is recovered by theliquid recovery part 80, which is connected to the cover member 70. Bysucking the gas inside the cover member 70 together with the scatteredliquid LQ, the liquid recovery part 80 recovers the liquid LQ scatteredfrom the substrate P. Here, the liquid recovery part 80 continuouslyperforms the operation of sucking the gas inside the cover member 70 andthe scattered liquid LQ. Thereby, the liquid LQ does not pool inside thecover member 70, e.g., on the inner wall or at the bottom thereof, andthe humidity inside the cover member 70 therefore does not fluctuategreatly. In addition, the humidified gas inside the cover member 70 doesnot flow out of it, even when the shutter parts 71A and 72A are opened.

After the liquid LQ on the rear surface of the substrate P has beenremoved, pin members (not shown) rise from the holding table HT andsupport the rear surface of the substrate P. Furthermore, the pinmembers provided to the holding table HT have the same constitution asthe pin members 570 that were explained referencing FIG. 6A.Furthermore, after the substrate P is supported by the pin member, thesecond arm member H2 withdraws to the outside of the cover member 70,and the opening part 71 is closed by the shutter part 71A. Furthermore,by the lowering of the pin members, which support the substrate P, thesubstrate P is supported by the support surface 40 of the holding tableHT, as shown in FIG. 8B. After the substrate P is supported by thesupport surface 40, the control apparatus CONT activates the vacuumsystem 34 and holds the substrate P by suction through the suction holes41.

In addition, a blow nozzle 103, which constitutes one part of the firstliquid removal system 100, is disposed inside the cover member 70, and agas supply system 104 is connected to the blow nozzle 103 via apassageway 105. The passageway 105 is provided with a filter thatremoves foreign matter (waste, oil mist, and the like) in the gas thatis blown against the substrate P. Furthermore, by activating the gassupply system 104, a prescribed gas is blown against the front surfaceof the substrate P from the blow nozzle 103 through the passageway 105,and the liquid LQ that adhered to the front surface of the substrate Pis blown off and removed by that gas.

FIG. 9 is a drawing of the interior of the cover member 70 of FIG. 8B,viewed from above. The rear surface of the substrate P is supported bythe support surface 40 of the holding table HT. The blow nozzle 103includes a nozzle main body part 103A, of which the longitudinaldirection is in the Y axial direction, and a plurality of nozzle holes103B, which are provided so that they are lined up in the longitudinaldirection of the nozzle main body part 103A. The gas supplied from thegas supply system 104 is blown out from each of the plurality of nozzleholes 103B. The substrate P, which is held by the holding table HT, andthe blow nozzle 103 are provided so that they are capable of movingrelative to one another. The present embodiment is constituted so thatthe blow nozzle 103 can perform a scanning motion in the X axialdirection relative to the substrate P, which is held by the holdingtable HT. Furthermore, the holding table HT, which holds the substrateP, may move with respect to the blow nozzle 103, or both the holdingtable HT and the blow nozzle 103 may be moved. Furthermore, the liquidLQ that was blown off from the front surface of the substrate P isrecovered by the liquid recovery part 80.

The substrate P from which the liquid LQ on the front surface and therear surface has been removed, respectively, is transported by thefourth arm member H4 to the developer apparatus D. When the fourth armmember H4 transports the substrate P from the holding table HT, thecontrol apparatus CONT drives the shutter part 72A to open the openingpart 72, and the fourth arm member H4 enters from the opening part 72into the interior of the cover member 70. In parallel thereto, the pinmembers of the holding table HT raise the substrate P, and the fourtharm member H4 holds the rear surface of the raised substrate P.Furthermore, the holding table HT rotates before passing the substrate Pto the fourth arm member H4, and changes the substrate P to the desiredorientation. Furthermore, the fourth arm member H4, which holds thesubstrate P, unloads that substrate P from the interior of the covermember 70 through the opening part 72.

As explained above, before the second arm member H2 (or the holdingtable HT) supports the rear surface of the substrate P, gas is blownthrough the blow holes 32 (42), which constitute a liquid removalmechanism provided to the second arm member H2 (holding table HT) thatremoves the liquid LQ on the rear surface that is the surface of thesubstrate P to be supported, and it is therefore possible to prevent theproblem wherein the residual liquid LQ forms a lubricating film thatcauses the mispositioning of the substrate P with respect to the secondarm member H2 (holding table HT), and to support the substrate P in thedesired state. In addition, even if the present embodiment isconstituted so that the second arm member H2 (or the holding table HT)holds the substrate P by vacuum suction through the suction holes 31(41), removing the liquid LQ on the rear surface of the substrate Pmakes it possible to prevent the problem wherein the liquid LQinfiltrates the vacuum system 34.

In addition, by removing the liquid LQ that has adhered to at least thesupport area, which is supported by the second arm member H2, of therear surface of the substrate P, the second arm member H2 can transportthe substrate P in a state wherein such is satisfactorily held.Furthermore, by subsequently removing the liquid LQ that adhered to therear surface and the front surface of the substrate P using the firstliquid removal system 100, the occurrence of problems, such as theliquid LQ from that substrate P dropping and scattering in thesubsequent transport pathway of the substrate P are prevented.Furthermore, by sufficiently removing the liquid LQ on both the frontsurface and the rear surface of the substrate P, the prescribedprocesses after the immersion exposure process, such as the developmentprocess, can be smoothly performed without being adversely affected byresidual liquid LQ.

In the present embodiment, the liquid LQ that has adhered to thesubstrate P is removed by blowing gas thereagainst. Here, the gas thatis blown is preferably a dried gas, such as dry air. In so doing, theliquid LQ that has adhered to the substrate P dries, which promotesremoval. In addition to a gas of a temperature substantially the same asthat inside the chamber apparatus CH1, the blown gas may be warm airthat has a temperature higher than the interior of the chamber apparatusCH1. In addition, gases such as dry air, nitrogen gas, and helium gascan be used as the blown gas.

Furthermore, in the present embodiment, before the second arm member H2supports the rear surface of the substrate P, the liquid LQ is removedusing the blow holes 32, which constitute one part of the liquid removalmechanism provided to the second arm member H2; however, the liquid LQmay be removed by blowing gas against the rear surface of the substrateP from a blow hole provided to a member separate from the second armmember H2, after which the second arm member H2 may then support therear surface of the substrate P. Likewise, even before the holding tableHT holds the substrate P, instead of removing the liquid LQ on the rearsurface of the substrate P using the blow hole 42 provided to theholding table HT, the liquid LQ may be removed by blowing gas againstthe rear surface of the substrate P from a blow hole provided to aseparate member.

The following explains another embodiment of the present invention,referencing FIG. 10. In the explanation below, constituent elements thatare identical or equivalent to the embodiment discussed above areassigned the same symbol, and the explanation thereof is simplified oromitted.

The abovementioned embodiments are constituted so that the suction holes31 and the blow holes 32 are provided to the support surface 30 of thesecond arm member H2 at mutually differing positions, but the feature ofthe present embodiment is that the opening parts provided to the supportsurface 30 function both as suction holes and blow holes.

In FIG. 10, the opening parts 31 are provided to the support surface 30of the second arm member H2. Furthermore, one end part of the passageway31A is connected to the opening parts 31, and the other end part of thepassageway 31A branches to a first passageway 38 and a second passageway39; furthermore, the first passageway 38 is connected to the vacuumsystem 34, and the second passageway 39 is connected to the gas supplysystem 35. A valve 38A that opens and closes the first passageway 38 isprovided thereon, and a valve 39A that opens and closes the secondpassageway 39 is provided thereon. The control apparatus CONT controlsthe operation of the valves 38A and 39A.

Before the second arm member H2 shown in FIG. 10 holds the rear surfaceof the substrate P for which the immersion exposure process hascompleted, the control apparatus CONT drives the valves 38A and 39A toopen the second passageway 39 as well as close the first passageway 38,and activates the gas supply system 35. Thereby, the gas is blownagainst the rear surface of the substrate P through the opening parts(blow holes) 31, and it is therefore possible to remove the liquid LQthat has adhered to the rear surface of the substrate P. Furthermore,after the completion of the removal of the liquid LQ that has adhered tothe rear surface of the substrate P, the control apparatus CONT drivesthe valves 38A and 39A to open the first passageway 38 and close thesecond passageway 39, stops the operation of the gas supply system 35,and activates the vacuum system 34. In so doing, the second arm memberH2 can hold the substrate P by suction through the opening parts(suction holes) 31. Thus, it is also possible to remove the liquid LQthat has adhered to the substrate P, and to hold such by suction byselectively connecting the gas supply system 35 and the vacuum system 34to the opening parts 31 using the first and second passageways 38, 39and the valves 38A and 39A to selectively connect. In addition, not onlycan the liquid be removed by blowing the gas, but the liquid on the rearsurface of the substrate P may also be sucked, or both may be performedin parallel.

FIG. 11 shows an example wherein a moisture absorbing material 90 isprovided to the upper surface 30 of the second arm member H2. In FIG.11, the moisture absorbing material 90, which absorbs the liquid LQ, isprovided to the upper surface 30 of the second arm member H2. A spongemember, porous ceramics, or the like can be used as the moistureabsorbing material 90.

When the second arm member H2 shown in FIG. 11 supports the rear surfaceof the substrate P, the moisture absorbing material 90 provided to thesecond arm member H2 is brought into contact with the rear surface ofthe substrate P before the rear surface of the substrate P is supported.In so doing, the liquid LQ that has adhered to the rear surface of thesubstrate P is absorbed by the moisture absorbing material 90 andremoved from the rear surface of the substrate P. Furthermore, whenusing the moisture absorbing material 90 to remove the liquid LQ thathas adhered to the rear surface of the substrate P, the moistureabsorbing material 90 may be brought to a position close to thesubstrate P so that the moisture absorbing material 90 and the substrateP are spaced apart by just a prescribed distance, and the liquid LQ thathas adhered to the rear surface of the substrate P may be absorbed(removed) using the capillary phenomenon.

After the liquid LQ that has adhered to the rear surface of thesubstrate P has been removed using the moisture absorbing material 90,the control apparatus CONT brings the second arm member H2 (moistureabsorbing material 90) into contact with the rear surface of thesubstrate P, and activates the vacuum system 34, which is connected tothe suction holes 31 via the passageway 31A. The suction holes 31 holdthe rear surface of the substrate P by suction through the moistureabsorbing material 90. In so doing, a lubricating film of the liquid LQis not formed between the substrate P and the second arm member H2(moisture absorbing material 90), and it is therefore possible toprevent the occurrence of the problem wherein the substrate P ismispositioned with respect to the second arm member H2. Here, it ispreferable to provide the gas-liquid separator 800 between the vacuumsystem 34 and the suction holes 31 of the passageway 31A. Because themoisture absorbing material 90 contains the liquid LQ, there is a riskthat the operation of the vacuum system 34 will cause the liquid LQcontained in the moisture absorbing material 90 to infiltrate the vacuumsystem 34. However, by separating the liquid component sucked by thesuction holes 31 using the gas-liquid separator 800 so that only the gascomponent flows into the vacuum system 34, it is possible to prevent theoccurrence of problems, such as damage to the vacuum system 34.

Furthermore, although the moisture absorbing material 90 is providedherein to the upper surface 30 of the second arm member H2, it is alsoacceptable to support the moisture absorbing material 90 by a separatesupport member without providing the moisture absorbing material 90 tothe second arm member H2. In this case, before the second arm member H2supports the rear surface of the substrate P, the liquid LQ that hasadhered to the rear surface of the substrate P is absorbed (removed) bythe moisture absorbing material 90, which is supported by theabovementioned support member, and the rear surface of the substrate Pis then supported by the second arm member H2. In addition, when usingthe moisture absorbing material 90 to remove the liquid LQ that hasadhered to the rear surface of the substrate P, the absorption may beexecuted by pressing the moisture absorbing material 90 against the rearsurface of the substrate P, or the absorption may also be executed whilemoving the substrate P and the moisture absorbing material 90 relativeto one another. In addition, in this case as well, the absorption can beexecuted using the capillary phenomenon in a state wherein the moistureabsorbing material 90 and the rear surface of the substrate P areslightly spaced apart without making contact. In so doing, the rearsurface of the substrate P does not get damaged. In addition, it is alsopossible to provide the moisture absorbing material 90 to the uppersurface 40 of the holding table HT.

In the abovementioned embodiment, the first liquid removal system 100,which removes the liquid LQ that has adhered to the front surface of thesubstrate P, removes the liquid LQ by blowing gas from the blow nozzle103 against the front surface of the substrate P, but it is alsopossible to fling off and remove the liquid LQ that has adhered to thefront surface of the substrate P by rotating the substrate P.

FIG. 12A-B show the first liquid removal system 100, which includes arotary mechanism that flings off the liquid LQ, which has adhered to thefront surface of the substrate P, by rotating the substrate P. In FIG.12A-B, the holding table HT of the first liquid removal system 100includes a holder part 121, which holds the center part of the rearsurface of the substrate P, and a rotary mechanism 122, which rotatesthe holder part 121 that holds the substrate P. A suction hole isprovided in the upper surface of the holder part 121, which holds thecenter part of the rear surface of the substrate P by suction. Therotary mechanism 122 is constituted by a motor, which is provided insidethe holding table HT, and rotates the holder part 121 by rotating ashaft part 123, which is connected to the holder part 121. The shaftpart 123 is expandably and contractably provided, and the holder part121, along with the shaft part 123, is provided liftable with respect tothe upper surface 40 of the holding table HT. When the holder part 121,which holds the substrate P, rises with respect to the upper surface 40of the holding table HT, the substrate P becomes spaced apart from theholding table HT, and can be rotated by driving the rotary mechanism122. Meanwhile, when the holder part 121 is lowered, the substrate P isheld on the upper surface 40 of the holding table HT by the suction fromthe suction holes 41.

As shown in FIG. 12A, before the rear surface of the substrate P issupported by the holding table HT, gas is blown against the rear surfaceof the substrate P from the blow hole 42 formed at the center part ofthe holder part 121, which functions as the substrate support member ofthe holding table HT. Thereby, the liquid LQ that has adhered to therear surface of the substrate P is removed. Subsequently, the holderpart 121 rises while holding the substrate P by suction and rotatessuch, as shown in FIG. 12B. Thereby, the liquid LQ that has adhered tothe front surface of the substrate P is flung off and removed.

Incidentally, the lower part of the cover member 70 shown in FIG. 12A-Bis inclined so that it gradually widens downwardly. Thereby, even if theliquid LQ that flung off from the substrate P hits the inner wall of thecover member 70, the cover member 70 is shaped so that it graduallywidens downwardly, which makes it possible to prevent the problemwherein the liquid LQ that hits the inner wall bounces back and onceagain adheres to the substrate P. Furthermore, as mechanisms to preventthe bounce back of the liquid LQ, it is also possible, in addition toinclining the inner wall of the cover member 70, to prevent the problemwherein the liquid LQ that hits the inner wall of the cover member 70bounces back to the substrate P side by, for example, attaching amoisture absorbing material to the inner wall of the cover member 70,making the inner wall jagged shaped (waveform shape), or providing asuction port that is connected to a liquid suction apparatus.

As shown in FIG. 13, it is also possible to remove the liquid LQ thathas adhered to the front surface of the substrate P by using a liquidsuction apparatus 140 to suck and recover the liquid LQ. In FIG. 13, arecovery nozzle 142 is connected to the liquid suction apparatus 140 viaa recovery pipe 141. The recovery nozzle 142 is disposed close to thefront surface of the substrate P, which is held by the holding table HT.The liquid suction apparatus 140 configured to include, for example, avacuum system, and is provided with a gas-liquid separator (not shown),which separates the liquid and the gas recovered by the recovery nozzle142, along the recovery pipe 141. When removing the liquid LQ that hasadhered to the front surface of the substrate P, the recovery nozzle 142approaches the front surface of the substrate P, and the liquid LQ onthe front surface of the substrate P is collected, by activating theliquid suction apparatus 140, through the recovery nozzle 142 and therecovery pipe 141 into a recovery tank, or the like, which is providedto the liquid suction apparatus 140. In addition, even when removing theliquid LQ on the front surface of the substrate P through the recoverynozzle 142, the liquid LQ can be removed while moving the recoverynozzle 142 and the substrate P relative to one another.

Furthermore, the shape and arrangement of the recovery nozzles (25) asexplained referencing FIG. 4, for example, may be adapted to therecovery nozzle 142. Alternatively, a recovery member that has anannular recovery port may be adopted as the recovery nozzle.

In addition, the liquid LQ that has adhered to the front surface of thesubstrate P may be dried by a drying apparatus 150 that supplies dry airor warm gas to the interior of the cover member 70 that houses thesubstrate P.

In the abovementioned embodiment, the liquid is removed, by blowing gasagainst the rear surface of the substrate P with the gas blowingmechanism provided to the second arm member H2, from the portion of thearea, which is supported by the second arm member H2, of the rearsurface of the substrate P, but the liquid on the rear surface outsideof that portion and on the front surface of the substrate P may beremoved by the following constitution. Namely, as shown in FIG. 14, awall member 160 is provided on the transport pathway of the second armmember H2, and a gas blow nozzle 161 is attached to each of the upperand lower sides of the wall member 160. Furthermore, when the substrateP passes through an opening part 162, it is possible to remove theliquid LQ that has adhered to the substrate P by the gas blow nozzles161 blowing gas against the front surface and the rear surface of thesubstrate P, respectively. Furthermore, gas can be blown over the entirearea of the substrate P by the gas blow nozzles 161 blowing gas againstthe substrate P while transporting and moving the substrate P. In thisconstitution as well, it is possible to remove the liquid LQ that hasadhered to the front surface or the rear surface of the substrate P, aswell as the liquid that has adhered to the second arm member H2.

Furthermore, when blowing gas from the gas blow nozzles against the rearsurface of the substrate P, gas is blown in the present embodiment froma direction orthogonal to the rear surface of the substrate P, but maybe blown from a direction that intersects the rear surface (a obliquedirection, e.g., 45°).

The following explains the second liquid removal system 220, which isprovided with the transport system H of the present embodiment. Thesecond liquid removal system 220 is principally for the purpose ofremoving the liquid LQ that has adhered to the surface of the second armmember H2. As shown in FIG. 1 and FIG. 2, the second liquid removalsystem 220 is provided on the movement pathway of the second arm memberH2, specifically on the transport pathway of the substrate P between thesubstrate stage PST and the holding table HT. Namely, in the transportsystem H of the present embodiment, the second arm member H2 unloads thepost-exposure substrate P from the substrate stage PST and transportsthat substrate P to the holding table, after which the second liquidremoval system 220 removes the liquid that has adhered to the second armmember H2.

FIG. 15 schematically shows an example of the constitution of the secondliquid removal system 220.

In FIG. 15, the second liquid removal system 220 is configured toinclude gas spray parts (first gas spray part 221 and second gas spraypart 222) that spray gas against the second arm member H2, a gas supplyapparatus 223 that supplies gas to the gas spray parts 221 and 222, achamber 224 that houses the gas spray parts 221 and 222, and a liquidsuction apparatus 225 that sucks the liquid inside the chamber 224.

The first gas spray part 221 sprays gas toward the upper surface of thesecond arm member H2, and the second gas spray part 222 sprays gastoward the lower surface of the second arm member H2. The first gasspray part 221 and the second gas spray part 222 are disposed mutuallyspaced apart by a prescribed spacing, and the second arm member H2 isinterposed therebetween. In addition, the first gas spray part 221 andthe second gas spray part 222 are each connected to the gas supplyapparatus 223 via a supply pipe 226. The supply pipe 226 is providedwith a filter (not shown) that removes impurities (particles, oil mist,and the like) in the gas. Furthermore, dry air is used as the spray gasin the present embodiment. Other gases may be used as the spray gas,such as nitrogen gas and helium gas.

The liquid suction apparatus 225 generates vacuum pressure and sucks theliquid inside the chamber 224, and is connected to the chamber 224 via apiping 225 a. In addition, a valve 225 b is openably and closablyprovided to and disposed in the piping 225 a.

An opening 227 is provided to the chamber 224 in order for the secondarm member H2 to enter and exit the chamber 224, and a shutter 228 isprovided to the opening 227. Furthermore, a liquid detector 229, whichdetects whether the liquid has adhered to the second arm member H2, isprovided outside of the chamber 224 and in the vicinity of the opening227 of the chamber 224.

If the adherence of liquid to the second arm member H2 has been detectedas a result of detection by the liquid detector 229, then the second armmember H2 is inserted into the chamber 224, and the liquid that hasadhered to the second arm member H2 is removed; however, if the liquidhas not adhered or if adhesion of the liquid is within a permissiblerange, then the second arm member H2 unloads the substrate P from thesubstrate stage PST without being inserted into the chamber 224.

In the present embodiment, an imaging device, such as a CCD camera, isused as the liquid detector 229. The image information imaged by theimaging device is sent to the control apparatus CONT (refer to FIG. 1).The control apparatus CONT stores the image information of the secondarm member H2 in a state wherein the liquid is not yet adhered. Thecontrol apparatus CONT judges whether the liquid has adhered to thesecond arm member H2 by comparing the current image information with,for example, the image information that was stored in advance.Furthermore, this judgment is not limited to automatic execution, and anoperator may judge whether the liquid has adhered to the second armmember H2 by displaying the image information imaged by the imagingdevice on a monitor and making judgment based on the state of thedisplayed second arm member H2. Furthermore, the second arm member H2can be inclined at a prescribed angle when judging whether the liquidhas adhered to the second arm member H2.

In addition, the liquid detector 229 is not limited to one that uses animaging device, and may be one that uses another detector as long as itis capable of detecting the liquid that has adhered to the second armmember H2, e.g., one that includes a light projecting device and a lightreceiving device, irradiates the second arm member H2 with light, andjudges whether the liquid has adhered to the second arm member H2 basedon the differential between the intensity of the reflected light,scattered light, and the like from the surface of the second arm memberH2 through the liquid, and the intensity of the reflected light, thescattered light, and the like from the surface of the second arm memberH2 not through the liquid; one that detects the differential between thepermittivity when the liquid has adhered to the surface of the secondarm member H2, and the permittivity when the liquid has not adhered tothe surface of the second arm member H2; or the like. In addition, theliquid detector 229 is not limited to a noncontact type, and may be acontact type. If a contact type liquid detector is used, then it ispreferable to sufficiently carry out cleaning measures so thatimpurities do not adhere to the second arm member H2 via that detector.

With the transport system H as constituted above, the surface of thesecond arm member H2, which moves the substrate P along the transportpathway, is appropriately detected by the liquid detector 229. If theadherence of liquid to the second arm member H2 is detected, then thecontrol apparatus CONT (refer to FIG. 1) inserts the second arm memberH2 into the chamber 224, and sprays gas from the gas supply apparatus223 through the gas spray parts 221 and 222 toward the second arm memberH2. At this time, by moving the second arm member H2 in the horizontaldirection (X direction) relative to the gas spray parts 221 and 222, theliquid that has adhered to the surface of the second arm member H2 isblown off by the sprayed gas, thereby removing the liquid from thesecond arm member H2. In addition, the liquid that was removed from thesecond arm member H2 is recovered by the liquid suction apparatus 225through the piping 225 a.

As explained above, the device fabrication system SYS of the presentembodiment performs the exposure process in the exposure apparatus mainbody EX based on the liquid immersion method. The liquid that hasadhered to the substrate P during the exposure process is removed fromthe substrate P by the first liquid removal system 100. In addition, ifthe liquid has adhered to the second arm member H2 that transports thesubstrate P after the exposure process, then that liquid is removed fromthe second arm member H2 by the second liquid removal system 220. Thesecond liquid removal system 220 is provided and disposed on thetransport pathway of the second arm member H2. Therefore, when removingthe liquid, there is little wasted movement of the second arm member H2,which suppresses deterioration in throughput. The removal of the liquidthat has adhered to the second arm member H2 prevents the occurrence oftransport problems, such as, for example, when transporting the nextsubstrate P, the slippage of that substrate P on the second arm memberH2. As a result, with the present device fabrication system SYS, thesubstrate P that has been exposed based on the liquid immersion methodcan be satisfactorily transported and stably processed.

Here, the liquid that has adhered to the second arm member H2 is removedat least at the point before unloading the substrate P from thesubstrate stage PST. Removing the liquid that has adhered to the secondarm member H2 before unloading the substrate reliably prevents transportproblems, such as the slippage of the substrate on the second arm memberH2.

In addition, the removal of the liquid from the second arm member H2 maybe performed after the substrate unload operation is completed by thesecond arm member H2, in addition to before the transport of thesubstrate discussed above. Namely, when the second arm member H2 towhich the liquid has adhered moves, there is a risk that the scatteringof that liquid will cause operational problems, environmental changes,and the like. Consequently, after the handover of the substrate P to thefirst liquid removal system 100 is complete, the liquid detector 229verifies whether the liquid has adhered to the second arm member H2; ifthe liquid LQ has adhered, then the second liquid removal system 220 isused to remove such, thereby enabling the suppression of such problems.

When removing the liquid from the second arm member H2, it is possibleto simultaneously remove the liquid that has adhered to at least one ofthe front surface and the rear surface of the substrate P supported bythe second arm member H2. If the liquid that has adhered to at least oneof the front surface and the rear surface of the substrate P can beremoved, then it is also possible to omit the first liquid removalsystem 100 discussed above.

In addition, in the present embodiment, the removal of liquid from thesecond arm member H2 is performed only when needed, based on thedetection result of the liquid detector 229, which is advantageous inthat it suppresses a deterioration in throughput due to the removal ofthe liquid. Furthermore, if there is a strong possibility that theliquid has adhered to the second arm member H2, then the operation ofdetecting the liquid by the liquid detector 229 can be omitted, and theliquid may be continuously removed from the second arm member H2.

FIG. 16 and FIG. 17 show other embodiments of the second liquid removalsystem 220.

The second liquid removal system 220 in FIG. 16 includes a liquidsuction apparatus 230, first and second suction parts 232 and 233 thatare connected to the liquid suction apparatus 230 by a piping 231 andthat suck the liquid that has adhered to the front surface and the rearsurface of the second arm member H2, respectively, and a dryingapparatus 235 that dries the interior of a chamber 234. Furthermore, thefirst and second suction parts 232 and 233 are provided capable ofmoving in the X axial direction relative to the second arm member H2. Inaddition, the chamber 234 is provided with an opening 236 so that thesecond arm member H2 can enter into and exit from the chamber 234, thesame as the embodiment in FIG. 15, and a shutter 237 is provided to thisopening 236.

When removing the liquid from the second arm member H2 by the secondliquid removal system 220 in FIG. 16, the liquid suction apparatus 230is operated in a state wherein the first and second suction parts 232and 233 have been brought a position close to the second arm member H2.Thereby, the liquid that has adhered to the second arm member H2 issucked by the liquid suction apparatus 230 through the first and secondsuction parts 232 and 233. At this time, the liquid that has adhered tothe second arm member H2 is removed by moving the first and secondsuction parts 232 and 233 and the second arm member H2 relative to oneanother in the X axial direction.

In addition, with this second liquid removal system 220, dried gas (dryair) is appropriately supplied inside the chamber 234 by the dryingapparatus 235. The supplied dry air may be of room temperature, or maybe warm gas, the temperature of which is controlled to a prescribedtemperature. Supplying dry air dries the interior of the chamber 234,which, as a result, promotes the removal of the liquid from the secondarm member H2.

Furthermore, in the second liquid removal system 220 as constitutedabove, the liquid suction apparatus 230 and the suction parts 232 and233, and the like may be omitted if the liquid is rapidly removed fromthe second arm member H2 just by supplying dry air by the dryingapparatus 235. In addition, the drying method is not limited to a gassupplying method, and other drying methods may be used, such as apressure reducing method, an infrared ray irradiating method, and thelike.

The second liquid removal system 220 of FIG. 17 includes a liquidsuction apparatus 240, moisture absorbing materials 242 and 243 that areconnected to the liquid suction apparatus 240 via a piping 241, and adrive apparatus 244 that moves the moisture absorbing materials 242 and243 in the Z direction. A sponge member, porous ceramics, and the likeare used as the moisture absorbing materials 242 and 243.

When removing the liquid from the second arm member H2 with the secondliquid removal system 220 in FIG. 17, the drive apparatus 244 tightlycontacts the moisture absorbing materials 242 and 243 with the secondarm member H2. If the liquid suction apparatus 240 is activated in thisstate, and the liquid absorbed by the moisture absorbing materials 242and 243 is recovered, then the liquid that has adhered to the second armmember H2 is removed. By removing the liquid using the moistureabsorbing materials 242 and 243, there is little scattering of theliquid. Consequently, it is possible to omit the chamber (casing), whichmakes the apparatus more compact. Furthermore, if the liquid cannot beremoved rapidly from the second arm member H2 by the absorption by themoisture absorbing materials 242 and 243, then the present constitutionmay be combined with the drying apparatus shown in the previous FIG. 16.

Furthermore, the moisture absorbing material 90 shown in FIG. 11 may beprovided with the function of removing the liquid from the arm.

In the present embodiment, if the liquid LQ has adhered to the secondarm member H2, then absorption can be executed by the moisture absorbingmaterial 90. Furthermore, the present embodiment may be constituted sothat the liquid absorbed by the moisture absorbing material 90 isrecovered through the vacuum system 34 that holds the substrate.According to this constitution, the moisture absorbing material 90constitutes one part of the second arm member H2, which enables the sizeof the apparatus to be reduced. In addition, it is possible to removethe liquid from the second arm member H2 at an arbitrary position andwith an arbitrary timing. For example, the liquid can be removed fromthe second arm member H2 while moving it. Consequently, it is possibleto enhance throughput.

The above-explained embodiment of the constitution of the second liquidremoval system 220, but the constitution by which the liquid is removedfrom the second arm member H2 is not limited to the one discussed above.In addition, the various constitutions discussed above may of course beappropriately combined.

FIG. 18 shows another embodiment of a transport system H provided withthe second liquid removal system 220. In FIG. 18, the transport system Hincludes a cleaning apparatus 260, which cleans the second arm memberH2, in addition to the second liquid removal system 220 that removes theliquid that has adhered to the second arm member H2. Furthermore, in thepresent embodiment, the gas spray type shown in FIG. 15 may be used asthe second liquid removal system 220, and any of the constitutionalexamples explained in the present embodiment may be adapted.

The cleaning apparatus 260 includes a cleaning liquid supply apparatus261 that supplies cleaning liquid, liquid spray parts 263 and 264, whichare connected via a piping 262 to the cleaning liquid supply apparatus261 and that spray the cleaning liquid toward the second arm member H2,and a chamber 265 that houses the liquid spray parts 263 and 264. Inaddition to pure water, various chemicals are appropriately used as thecleaning liquid. In addition, the liquid spray parts 263 and 264 areconstituted, for example, so that a plurality of spray nozzles areprovided to a head portion, which is connected to the cleaning liquidsupply apparatus 261. Furthermore, in the constitutional example shownin FIG. 18, the second liquid removal system 220 and the cleaningapparatus 260 are disposed lined up in the vertical direction, but maybe disposed lined up in the horizontal direction. Furthermore, thecleaning liquid inside the chamber 265 is appropriately recoveredthrough a recovery piping (not shown).

If the liquid has adhered to the second arm member H2, then there is apossibility that impurities will adhere to the second arm member H2 dueto the liquid adhesion. Furthermore, if those impurities remain on thesecond arm member H2, then there is a risk that, when transporting thenext substrate to be exposed, the impurities will adhere to thatsubstrate. With the transport system H in FIG. 18, the post-exposuresubstrate P, is unloaded from the substrate stage PST by the second armmember H2, that substrate P is transported to the holding table HT, thesecond arm member H2 is then cleaned in the cleaning apparatus 260, andthe liquid that has adhered to the second arm member H2 is subsequentlyremoved by the second liquid removal system 220. Accordingly, with thepresent transport system H, cleaning the second arm member H2 suppressesthe adhesion of impurities to the pre-exposure substrate.

Furthermore, the cleaning method of the second arm member H2 is notlimited to the method wherein the cleaning liquid is sprayed, and othermethods may be used, such as a method in which the second arm member H2is immerged in cleaning liquid stored in a tank, an ultrasonic cleaningmethod, or the like. In addition, the present embodiment is not limitedto the use of cleaning liquid, and a so-called optical cleaning methodmay be used wherein, for example, light (UV light, or the like), ozone,and the like is used. Furthermore, instead of cleaning the second armmember H2 with the unloading of every substrate P, cleaning may beperformed with every unloading of a prescribed number of substrates P.In addition, a foreign matter detector that detects foreign matter(impurities) on the surface (including the rear surface and sidesurfaces) of the second arm member H2 may be provided separate from theliquid detector 229; for example, after the removal of the liquid by thesecond liquid removal system 220, verification may be executed to verifywhether foreign matter has adhered to the second arm member H2 and, ifforeign matter has adhered, then the cleaning apparatus 260 may be usedto clean the second arm member H2. By suppressing the adhesion ofimpurities to the substrate before it is exposed, it is possible toenhance exposure accuracy during the exposure process.

Here, with respect to the exposure process by the liquid immersionmethod, pure water is used in the present embodiment as the liquid LQused in the exposure process. Pure water can be easily obtained in largequantities at semiconductor fabrication plants or the like, and has anadvantage in that it does not adversely affect the photoresist on thesubstrate P, the optical elements (lenses), and the like. In addition,pure water does not adversely affect the environment and has anextremely low impurity content, and can therefore be expected to alsoserve the function of cleaning the front surface of the substrate P, aswell as the surface of the optical element provided at the tip surfaceof the projection optical system PL.

Further, because the refractive index n of pure water (water) for theexposure light EL that has a wavelength of approximately 193 nm issubstantially 1.44, the use of ArF excimer laser light (193 nmwavelength) as the light source of the exposure light EL would shortenthe wavelength on the substrate P to 1/n, i.e., approximately 134 nm,thereby obtaining a high resolution. Furthermore, because the depth offocus will increase approximately n times, i.e., approximately 1.44times, that of in air, the numerical aperture of the projection opticalsystem PL can be further increased if it is enough to ensure a depth offocus approximately the same as that when used in air, and theresolution is also improved from this standpoint.

In the present embodiment, the lens 2 is attached to the tip of theprojection optical system PL; the optical element attached to the tip ofthe projection optical system PL may be an optical plate that is used toadjust the optical characteristics, e.g., aberrations (sphericalaberration, coma aberration, and the like), of the projection opticalsystem PL. Alternatively, the optical element may be a parallel planeplate capable of transmitting the exposure light EL.

Furthermore, if the pressure generated by the flow of the liquid LQbetween the optical element at the tip of the projection optical systemPL and the substrate P is large, then the optical element may be rigidlyfixed so that it does not move due to that pressure, instead of makingit exchangeable.

Furthermore, the present embodiment is constituted so that the liquid LQis filled between the projection optical system PL and the surface ofthe substrate P, but it may be constituted so that, for example, theliquid LQ is filled in a state wherein a cover glass, comprising aparallel plane plate, is attached to the surface of the substrate P.

Furthermore, although the liquid LQ in the present embodiment is water,it may be a liquid other than water. For example, if the light source ofthe exposure light EL is an F₂ laser, then the F₂ laser light will nottransmit through water, so it would be acceptable to use a fluorinebased fluid, such as perfluorinated polyether (PFPE) or fluorine basedoil, which is capable of transmitting F₂ laser light, as the liquid LQ.In addition, it is also possible to use as the liquid LQ one (e.g.,cedar oil) that is transparent to the exposure light EL, has the highestpossible refractive index, and is stable with respect to the projectionoptical system PL and the photoresist coated on the surface of thesubstrate P.

Furthermore, the substrate P in each of the abovementioned embodimentsis not limited to a semiconductor wafer for fabricating semiconductordevices, and is also applicable to a glass substrate for a displaydevice, a ceramic wafer for a thin film magnetic head, or a mask ororiginal plate of a reticle (synthetic quartz, silicon wafer) used by anexposure apparatus, and the like.

In addition, in the embodiments discussed above, an exposure apparatusis adopted that locally fills the space between the projection opticalsystem PL and the substrate P with the liquid, but the present inventionmay also be adapted to a liquid immersion exposure apparatus that movesa stage, which holds the substrate to be exposed, in a liquid bath, asdisclosed in Japanese Published Unexamined Patent Application No.H6-124873, as well as to a liquid immersion exposure apparatus thatforms a liquid pool, which has a prescribed depth, on the stage andholds the substrate therein, as disclosed in Japanese PublishedUnexamined Patent Application No. H10-303114.

In addition to a step-and-scan system scanning type exposure apparatus(scanning stepper) that scans and exposes the pattern of the mask M bysynchronously moving the mask M and the substrate P, the exposureapparatus (exposure apparatus main body) EX may also be adapted to astep-and-repeat system projection exposure apparatus (stepper) thatexposes the full pattern of the mask M, with the mask M and thesubstrate P in a stationary state, and sequentially steps the substrateP. In addition, the present invention is also applicable to astep-and-stitch system exposure apparatus that partially andsuperimposingly transfers at least two patterns onto the substrate P.

The type of exposure apparatus EX is not limited to semiconductor devicefabrication exposure apparatuses that expose the pattern of asemiconductor device on the substrate P, but is also widely applicableto exposure apparatuses for fabricating liquid crystal devices ordisplays, exposure apparatuses for fabricating thin film magnetic heads,imaging devices (CCD), or reticles and masks, and the like.

The exposure apparatus EX of the embodiments in the present applicationas described above is manufactured by assembling various subsystems,including each constituent element recited in the claims of the presentapplication, so that prescribed mechanical, electrical, and opticalaccuracies are maintained. To ensure these various accuracies,adjustments are performed before and after this assembly, including anadjustment to achieve optical accuracy for the various optical systems,an adjustment to achieve mechanical accuracy for the various mechanicalsystems, and an adjustment to achieve electrical accuracy for thevarious electrical systems. The assembly process from the varioussubsystems to the exposure apparatus includes the mutual mechanicalconnection of the various subsystems, the wiring and connection ofelectrical circuits, the piping and connection of the atmosphericpressure circuit, and the like. Of course, before the process ofassembling the exposure apparatus from these various subsystems, thereare processes for assembling each of the individual subsystems. When theprocess of assembling the exposure apparatus from the various subsystemsis completed, a comprehensive adjustment is performed to ensure thevarious accuracies of the exposure apparatus as a whole. Furthermore, itis preferable to manufacture the exposure apparatus in a clean roomwherein the temperature, the cleanliness level, and the like arecontrolled.

As shown in FIG. 19, a micro-device, such as a semiconductor device, ismanufactured by: a step 301 that designs the functions andperformance/characteristics of the micro-device; a step 302 thatfabricates a mask (reticle) based on this design step; a step 303 thatfabricates a substrate, which is the base material of the device; anexposure processing step 304 wherein the exposure apparatus EX of theembodiments discussed above exposes a pattern of the mask onto thesubstrate; a device assembling step 305 (comprising a dicing process, abonding process, and a packaging process); an inspecting step 306; andthe like.

The preferred embodiments according to the present invention wereexplained above, referencing the attached drawings, but the presentinvention is of course not limited to these embodiments. It is clearthat one of ordinary skill in the art can conceive of variousmodifications and changes within the field of the technical ideas asrecited in the claims, and it is understood that such modifications alsopertain to the technical scope of the present invention.

1. A substrate transport apparatus that transports a substrate that hasbeen exposed with an image of a pattern via a projection optical systemand a liquid, comprising: a substrate support member that supports thesubstrate; and a liquid removal mechanism that removes the liquid thathas adhered to at least one of the substrate support member and at leasta portion of the area of the rear surface of the substrate.
 2. Asubstrate transport apparatus as recited in claim 1, wherein thesubstrate support member is a substrate transport member that transportsthe substrate.
 3. A substrate transport apparatus as recited in claim 2,further comprising: a liquid detector that detects whether the liquidhas adhered to the substrate transport member; wherein, the liquidremoval mechanism removes the liquid that has adhered to the substratetransport member based on a detection result of the liquid detector. 4.A substrate transport apparatus as recited in claim 2, wherein theliquid removal mechanism has a gas spray part that sprays a prescribedgas against the substrate transport member.
 5. A substrate transportapparatus as recited in claim 2, wherein the liquid removal mechanismhas a moisture absorbing material that absorbs the liquid that hasadhered to the substrate transport member.
 6. A substrate transportapparatus as recited in claim 2, wherein the liquid removal mechanismsucks the liquid that has adhered to the substrate transport member. 7.A substrate transport apparatus as recited in claim 2, wherein theliquid removal mechanism dries the liquid that has adhered to thesubstrate transport member.
 8. A substrate transport apparatus asrecited in claim 2, wherein the liquid removal mechanism removes theliquid that has adhered to the substrate transport member together withthe liquid that has adhered to at least a portion of the area of therear surface of the substrate.
 9. A substrate transport apparatus asrecited in claim 2, comprising: a cleaning apparatus that cleans thesubstrate transport member.
 10. A substrate transport apparatus asrecited in claim 2, wherein the liquid removal mechanism is provided ona movement pathway of the substrate transport member.
 11. A substratetransport apparatus that transports a substrate that has been exposedwith an image of a pattern through a projection optical system and aliquid, comprising: a substrate transport member that transports thesubstrate and that has a moisture absorbing material that absorbs theliquid.
 12. A substrate transport apparatus as recited in claim 11,wherein the moisture absorbing material absorbs the liquid that hasadhered to the substrate.
 13. A substrate transport apparatus as recitedin claim 1, wherein the substrate support member supports the rearsurface of the substrate; and the liquid removal mechanism is providedto the substrate support member, and, before the substrate supportmember supports the rear surface of the substrate, removes the liquidthat has adhered to at least a portion of the area of the rear surfaceof the substrate.
 14. A substrate transport apparatus as recited inclaim 13, wherein the substrate support member is a substrate transportmember that transports the substrate to which the liquid has adhered.15. A substrate transport apparatus as recited in claim 14, wherein thesubstrate transport member has at least one opening part that opposesthe rear surface of the substrate; and the liquid removal mechanism hasa gas blowing mechanism that blows a prescribed gas through the openingpart against at least a portion of the area of the rear surface of thesubstrate.
 16. A substrate transport apparatus as recited in claim 15,comprising: a suction mechanism that sucks the rear surface of thesubstrate through the opening part to support the rear surface of thesubstrate; and a connection mechanism that selectively connects the gasblowing mechanism and the suction mechanism to the opening part.
 17. Asubstrate transport apparatus as recited in claim 14, comprising: asuction mechanism that sucks the rear surface of the substrate tosupport the rear surface of the substrate; wherein, the substratetransport member has at least one first opening part, which is connectedto the suction mechanism and opposes the rear surface of the substrate,and at least one second opening part, which opposes the rear surface ofthe substrate and is provided at a position different from the firstopening part; and the liquid removal mechanism has a gas blowingmechanism that blows the prescribed gas against the rear surface of thesubstrate through the second opening part.
 18. A substrate transportapparatus as recited in claim 13, wherein the liquid removal mechanismcomprises a moisture absorbing material that absorbs the liquid that hasadhered to at least a portion of the area of the rear surface of thesubstrate.
 19. A substrate transport apparatus as recited in claim 13,comprising: a liquid removal system that is provided on the transportpathway of the substrate, and that removes liquid that has adhered tothe front surface of the substrate; wherein, the substrate supportmember and the liquid removal mechanism are provided to the liquidremoval system.
 20. A substrate transport apparatus as recited in claim19, wherein the liquid removal system has a drying mechanism that driesthe liquid that has adhered to the front surface of the substrate, or arotary mechanism that flings off liquid that has adhered to the frontsurface of the substrate by rotating the substrate.
 21. A substratetransport apparatus as recited in claim 13, comprising: a holding tablethat is provided on the transport pathway of the substrate and thattemporarily holds the substrate; wherein, the substrate support memberand the liquid removal mechanism are provided to the holding table. 22.A substrate transport apparatus as recited in claim 13, wherein theliquid removal mechanism removes liquid that has adhered to a supportarea, which functions as the at least a portion of the area, that issupported by the substrate support member.
 23. A substrate transportapparatus that transports a substrate that has been exposed with animage of a pattern through a projection optical system and a liquid,comprising: a first liquid removal mechanism that removes liquid thathas adhered to a portion of the area of the rear surface of thesubstrate; and a second liquid removal mechanism that, after the liquidthat has adhered to the portion of the area of the rear surface of thesubstrate has been removed by the first liquid removal mechanism,removes the liquid that has adhered to the front surface of thesubstrate.
 24. A substrate transport apparatus as recited in claim 23,comprising: a substrate transport member that transports the substrateto which the liquid has adhered; wherein, the first liquid removalmechanism removes the liquid that has adhered to a first support area,at which the substrate transport member supports the rear surface of thesubstrate, of the rear surface of the substrate.
 25. A substratetransport apparatus as recited in claim 24, wherein the substratetransport member supports the first area, wherein the liquid has beenremoved, and transports the substrate to the second liquid removalmechanism.
 26. A substrate transport apparatus as recited in claim 23,wherein the second liquid removal mechanism has a drying mechanism thatdries the liquid that has adhered to the front surface of the substrate,or a rotary mechanism that flings off the liquid that has adhered to thefront surface of the substrate by rotating the substrate.
 27. Asubstrate transporting method that transports a substrate that has beenexposed with an image of a pattern through a projection optical systemand a liquid, comprising: removing, before supporting the rear surfaceof the substrate by a substrate support member, liquid that has adheredto a support area, which is supported by the substrate support member,of the rear surface of the substrate.
 28. A substrate transportingmethod as recited in claim 27, wherein the substrate support member is atransport arm member that transports the substrate to which the liquidhas adhered.
 29. A substrate transporting method as recited in claim 28,wherein the removal of the liquid is performed by blowing a prescribedgas from an opening part, which is formed in the transport arm member.30. A substrate transporting method as recited in claim 28, wherein theremoval of the liquid is performed by using a moisture absorbingmaterial, which is provided to the transport arm member.
 31. A substratetransporting method as recited in claim 27, comprising: removing theliquid that has adhered to the front surface of the substrate by using aliquid removal system provided on a transport pathway of the substrate;wherein, the substrate support member is provided to the liquid removalsystem.
 32. A substrate transporting method as recited in claim 27,comprising: temporarily holding the substrate by using a holding tableprovided on a transport pathway of the substrate; wherein, the substratesupport member is provided to the holding table.
 33. A substratetransporting method that transports a substrate that has been exposedwith an image of a pattern through a projection optical system and aliquid, comprising: removing the liquid that has adhered to a portion ofthe area of the rear surface of the substrate; and removing, after theliquid that has adhered to the portion of the area has been removed,liquid that has adhered to the front surface of the substrate.
 34. Asubstrate transporting method as recited in claim 33, wherein theportion of the area of the rear surface of the substrate is a firstsupport area at which the rear surface of the substrate is supported bya transport arm member that transports the substrate.
 35. A substratetransporting method as recited in claim 34, wherein the transport armmember supports the first support area, wherein the liquid has beenremoved, and transports the substrate to a second liquid removalapparatus, which removes the liquid that has adhered to the frontsurface of the substrate.
 36. A substrate transporting method as recitedin claim 35, comprising: removing, before the second liquid removalapparatus supports the rear surface of the substrate, liquid that hasadhered to a second support area, which is supported by the secondliquid removal apparatus, of the rear surface of the substrate.
 37. Anexposing method that exposes a substrate by projecting an image of apattern onto the substrate, which is held by a substrate stage, througha projection optical system and a liquid, comprising: a process in whichthe substrate is transported from the substrate stage by using asubstrate transporting method as recited in claim
 27. 38. An exposureapparatus that exposes a substrate by projecting an image of a patternonto the substrate, which is held by a substrate stage, through aprojection optical system and a liquid, comprising: a substratetransport member that unloads the substrate after exposure from thesubstrate stage; and a liquid removal mechanism that, before thesubstrate is transported from the substrate stage, removes the liquidthat has adhered to the substrate transport member.
 39. An exposureapparatus as recited in claim 38, wherein the liquid removal mechanismremoves the liquid that has adhered to the substrate transport membertogether with the liquid that has adhered to the substrate.
 40. Anexposure apparatus that exposes a substrate by projecting an image of apattern onto the substrate, which is held by a substrate stage, througha projection optical system and a liquid, wherein the substrate istransported from the substrate stage by using a substrate transportapparatus as recited in claim
 1. 41. A device fabricating method,comprising: using an exposing method as recited in claim 37.